PART |
Description |
Maker |
EUP2796JIR1 EUP2796 |
32Mb, 1M x 32, 3.0Volt Boot Block FLASH Array, Multi-Chip Module (MCM) 双显示器白光LED驱动3/2X开关电容升 512K x 32, 5V, MCM, Even-Sectored 双显示器白光LED驱动3/2X开关电容升 Dual-Display White LED Driver with 3/2X Switched Capacitor Boost
|
Eutech Microelectronics, Inc. 德信科技股份有限公司 Eutech Microelectronics Inc
|
LH532000B LH532000BT |
CMOS 2M (256K x 8/128K x 16) MROM 200万的CMOS56 × 8/128K × 16MROM LH532000BT CMOS 1M (128K x 8) Mask Programmable ROM 48-pin TSOP
|
Sharp, Corp. Sharp Corporation Sharp Electrionic Components Sharp Electronics Corp.
|
89C1632RPQE-25 89C1632RPQH-25 89C1632RPQK-25 89C16 |
16 Megabit (512K x 32-Bit) MCM SRAM 512K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CQFP68 16 Megabit (512K x 32-Bit) MCM SRAM 512K X 32 MULTI DEVICE SRAM MODULE, 30 ns, CQFP68 16 Megabit (512K x 32-Bit) MCM SRAM 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CQFP68 16 Megabit (512K x 32-Bit) MCM SRAM 16兆位12k × 32的位)立方米的SRAM
|
Maxwell Technologies, Inc
|
M27C202-80F1 M27C202-70K6 M27C202-120F6 M27C202-90 |
128K X 16 OTPROM, 80 ns, PDSO40 128K X 16 OTPROM, 90 ns, PQCC44 128K X 16 UVPROM, 100 ns, CDIP40 2 MBIT (128KB X16) UV EPROM AND OTP EPROM
|
STMICROELECTRONICS ST Microelectronics
|
LCL1802-L LCL1902-L |
MCM LNA
|
RFHIC
|
LCL1903-L |
MCM LNA
|
RFHIC
|
LCL1503-L |
MCM LNA
|
RFHIC
|
LCL1502-L |
MCM LNA
|
RFHIC
|
LCL0912-L |
MCM LNA
|
RFHIC
|
CY62128V CY62128V18 CY62128V18L-200SC CY62128V18L- |
Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT02; Number of Contacts:6; Connector Shell Size:10; Connecting Termination:Solder; Circular Shell Style:Box Mount Receptacle 128K x 8 Static RAM 128K X 8 STANDARD SRAM, 70 ns, PDSO32 128K x 8 Static RAM 128K X 8 STANDARD SRAM, 200 ns, PDSO32 128K x 8 Static RAM 128K X 8 STANDARD SRAM, 100 ns, PDSO32 SWITCH DETECT PB SPST RT ANG .1A
|
CYPRESS[Cypress Semiconductor] Cypress Semiconductor Corp. Cypress Semiconductor, Corp.
|
79C0408RT4FK-20 79C0408 79C0408RPFE-12 79C0408RPFE |
4 Megabit (512k x 8-bit) EEPROM MCM
|
MAXWELL[Maxwell Technologies]
|